Crack Catcher AI — Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages
The importance of silicon cannot be undermined-in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells/wafers crack easily during manufacturing assembly and/or during device operations. Crack Catcher AI uses novel smart fracture mechanics approach with Artificial Intelligence (AI) methodologies to predict and control crack/damage evolution in thin silicon cells/wafers. This is critical as semiconductor 3D integration technology calls for wafer-to-wafer bonding with utmost alignment accuracy and yield/reliability.
Authors:
Gabriel Preston, Greer Gonzolez, Andrea S. Karnyoto, Fitya S. Mozar, Matthew M. Henry, Mahmud Isnan, Kuncahyo S. Nugroho, Henry Candra, Muhamad Doris, Dianing N. N. Putri, Tyas K Sari, Bens Pardamean, Endang Djuana, Derrric Speaks, Arief S. Budiman
2025 International Reliability Physics Symposium