{"id":2825,"date":"2025-09-26T22:44:54","date_gmt":"2025-09-26T15:44:54","guid":{"rendered":"https:\/\/research.binus.ac.id\/airdc\/?p=2825"},"modified":"2026-05-04T10:36:18","modified_gmt":"2026-05-04T03:36:18","slug":"crack-catcher-ai-enabling-smart-fracture-mechanics-approach-for-damage-control-in-thin-silicon-wafers-for-3d-semiconductor-integrated-devices-packages","status":"publish","type":"post","link":"https:\/\/research.binus.ac.id\/airdc\/2025\/09\/crack-catcher-ai-enabling-smart-fracture-mechanics-approach-for-damage-control-in-thin-silicon-wafers-for-3d-semiconductor-integrated-devices-packages\/","title":{"rendered":"Crack Catcher AI \u2014 Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices\/Packages"},"content":{"rendered":"<p style=\"text-align: justify\"><span data-sheets-root=\"1\">The importance of silicon cannot be undermined-in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells\/wafers crack easily during manufacturing assembly and\/or during device operations. Crack Catcher AI uses novel smart fracture mechanics approach with Artificial Intelligence (AI) methodologies to predict and control crack\/damage evolution in thin silicon cells\/wafers. This is critical as semiconductor 3D integration technology calls for wafer-to-wafer bonding with utmost alignment accuracy and yield\/reliability.<\/span><\/p>\n<p><strong>Authors:<\/strong><br \/>\nGabriel Preston, Greer Gonzolez, Andrea S. Karnyoto, Fitya S. Mozar, Matthew M. Henry, Mahmud Isnan, Kuncahyo S. Nugroho, Henry Candra, Muhamad Doris, Dianing N. N. Putri, Tyas K Sari, Bens Pardamean, Endang Djuana, Derrric Speaks, Arief S. Budiman<\/p>\n<p><em>2025 International Reliability Physics Symposium<\/em><\/p>\n<p><a href=\"https:\/\/www.researchgate.net\/publication\/390427124_Crack_Catcher_AI_-Enabling_Smart_Fracture_Mechanics_Approach_for_Damage_Control_in_Thin_Silicon_Wafers_for_3D_Semiconductor_Integrated_DevicesPackages\" target=\"_blank\" rel=\"noopener\">Read Full Article<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>The importance of silicon cannot be undermined-in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells\/wafers crack easily during manufacturing assembly and\/or during device operations. Crack Catcher AI uses novel smart fracture mechanics approach with Artificial Intelligence (AI) methodologies to predict and control crack\/damage evolution in thin silicon cells\/wafers. [&hellip;]<\/p>\n","protected":false},"author":14,"featured_media":2826,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[],"class_list":["post-2825","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-publications"],"_links":{"self":[{"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/posts\/2825","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/users\/14"}],"replies":[{"embeddable":true,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/comments?post=2825"}],"version-history":[{"count":1,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/posts\/2825\/revisions"}],"predecessor-version":[{"id":2827,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/posts\/2825\/revisions\/2827"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/media\/2826"}],"wp:attachment":[{"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/media?parent=2825"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/categories?post=2825"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/research.binus.ac.id\/airdc\/wp-json\/wp\/v2\/tags?post=2825"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}